Technical Specifications for the Eclipse XP Metallization line

 

Performance  
Throughput Up to 3600 wph (subject to process)
Process Alignment Capability +/- 12.5 μm @ CpK ≥ 2.0
Breakage Rate < 0.1%
Parameters  
Screen Size 380mm x 380mm x 25mm
350mm x 350mm x 25mm with optional adaptor
450mm x 450mm x 25mm (optional) 
Wafer Size

125mm x 125mm +/- 1.0mm 
156mm x 156mm  +/- 1.0mm
(other sizes optional)

Squeegees Micro-tec, 60° trailing edge and 60° diamond
Configuration  
 Options  Weigh Station, Paste Dispenser, Wafer Breakage Sensor