Process benefits of the Eclipse XP Metallization Line

  • Fully modular & configurable metallization line
  • Multiple XtremePrint print head providing parallel processing options which maximises uptime
  • Throughput configurable up to 3600 wph (subject to process and excluding scheduled downtime)
  • Topside cameras for wafer edge, fiducial alignment
  • Integrated vision inspection for ultimate process and quality control
  • Integrated breakage detection
  • Fast yet sensitive handling; high speed, zero edge contact for negligible breakage rates
  • Multiple conveying, flipping, buffering & stacking options
  • Superior positional accuracy for high yield precision
  • Multi-language intuitive GUI control